Bondpad
SiFab contains two bondpads:
BondPad: parametric bondpad.
BONDPAD_5050: bondpad with locked properties.
BondPad
This is a customizable bondpad, where the size of the rectangular pads and the via pitch can be specified by the user.
The top metal layer is M1
and the bottom metal layer is M2
.
Reference
Click on the name of the component below to see the complete PCell reference.
Bondpad PCell with metal2 (M2) connected to metal1 (M1). |
Example
from si_fab import all as pdk
# Parametric bondpad
bp_p = pdk.BondPad(
name="BP",
metal1_size=(40.0, 60.0),
metal2_size=(40.0, 60.0),
via_pitch=(5.0, 5.0),
)
bp_p.Layout().visualize(annotate=True)
BONDPAD_5050
This bondpad inherits from BondPad
.
All the properties are locked to obtain an area of 50 \(\mu m\) x 50 \(\mu m\).
Reference
Click on the name of the component below to see the complete PCell reference.
Fixed default bondpad with an area determined by the design rules in the technology file (50 x 50 um^2). |
Example
from si_fab import all as pdk
# Fixed bondpad
bp = pdk.BONDPAD_5050()
bp.Layout().visualize(annotate=True)