si_fab.all.BondPad
- class si_fab.all.BondPad
Bondpad PCell with metal2 (M2) connected to metal1 (M1).
A bondpad is a large rectangular area on the top metal layer, used to connect external electrical wires, flip-chip bumps or probe needles.
- Parameters:
- via: PCell
Via used
- via_pitch: Coord2 and number >= 0
2D pitch (center-to-center) of the vias
- metal2_size: Coord2 and number >= 0
Size of the top metal layer
- metal1_size: Coord2 and number >= 0
Size of the bottom metal layer
- name: String that contains only ISO/IEC 8859-1 (extended ASCII py3) or pure ASCII (py2) characters
The unique name of the pcell
from si_fab import technology
from si_fab.all import BondPad
lo = BondPad().Layout()
lo.visualize(annotate=True)
Ports
Name |
Type |
Position |
Angle |
Waveguide Template |
Inclination |
|---|---|---|---|---|---|
m1 |
Electrical |
(0.0, 0.0) |
None |
M1WireTemplate |
0.0 |
m2 |
Electrical |
(0.0, 0.0) |
None |
M2WireTemplate |
0.0 |
Layout
Parameters
- view_name: String that contains only alphanumeric characters from the ASCII set or contains _$. ASCII set is extended on PY3.
The name of the view